Conference Invitation | Shengding Precision cordially invites you to attend the 17th China Semiconductor Industry Association Annual Conference on Semiconductor Discrete Devices

Dear customer

Hello!

Shengding Precision made its debut at the 17th China Semiconductor Industry Association Semiconductor Discrete Device Annual Conference and the 2023 China Semiconductor Device Technology Innovation and Industry Development Forum from July 19th to 21st. The purpose of this forum is to build a platform for interaction, exchange, and win-win cooperation for the third-generation semiconductor industry and academia. At that time, Shengding will set up a booth at the forum to showcase Shengding's semiconductor wafer segment and packaging and testing process products and solutions. We look forward to your visit!

Dongguan Shengding Precision Instrument Co, Ltd

July 17, 2023

Core exhibited products

ST3200 ICP PLASMA glue remover

Suitable for Ashing, polymer removal, dry removal of anti reflective patterned film layers, removal of photoresist after ion implantation, photoresist removal in radio frequency filter BAW/SAW process, dry removal of hard mask layers, surface cleaning after etching, DESCUM, surface residue removal, and other processes.

Product advantages:

Compatible with 4-8 inch circular wafers

Can process two wafers at a time, maintaining low temperatures during the processing

High degree of automation, achieving fully automatic wafer loading and unloading, cleaning process

High plasma density and good adhesive removal effect

RIE PLASMA glue remover

A cleaning equipment suitable for wafer surface debonding of silicon-based materials, which can be used for silicon carbide etching, silicon oxide or silicon nitride etching, medium to medium photoresist removal, dry removal of hard mask layers, surface cleaning after etching, DESCUM and other processes.

Product advantages:

Compatible with 4-8 inch circular wafers

High cleaning uniformity and easy maintenance of equipment

High plasma density and good adhesive removal effect

Microwave plasma SPV-100MWR

Using independently developed microwave plasma generators, the plasma is efficient and uniform, and can non-destructive remove impurities on semiconductor precision device substrates, oxide films on solder, and activate wafer surfaces. It has been widely used in the field of advanced semiconductor packaging.

Product advantages:

The product placement fixture is flexible and adaptable to irregular products

Electrodeless microwave design can meet the processing needs of soft products

• Electrically neutral plasma, without electrical damage to the product

Configure a magnetic fluid rotating frame to increase the uniformity of PLASMA processing

Other exhibition equipment

Seminar Introduction

Under the unified arrangement of the China Semiconductor Industry Association, the Semiconductor Discrete Devices Branch will hold the 17th China Semiconductor Industry Association Semiconductor Discrete Devices Annual Conference in Hangzhou from July 19 to 21, 2023. The conference will invite leaders from the Electronic Information Department of the Ministry of Industry and Information Technology and the China Semiconductor Industry Association to attend and provide guidance. We have organized expert invited reports, special reports, and corporate image and product exhibition activities to form a technology exchange platform mainly focused on the design, production, manufacturing, packaging and testing, research and development, and application of semiconductor devices in China. Together, we will promote the sustainable, collaborative, and rapid development of the semiconductor discrete device industry, and work together to master the core technologies of new devices and systems.